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LED Substrate Grinding Wheels Metal Bonded Abrasives ISO14001

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LED Substrate Grinding Wheels Metal Bonded Abrasives ISO14001

Brand Name : CAEC

Certification : ISO9001, ISO14001, OHSAS18001

Place of Origin : Henan, China

MOQ : One piece

Price : USD 1 for one piece

Supply Ability : 100000 pieces per month

Delivery Time : 7-10 days

Packaging Details : Standard package for export

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Grinding Wheels for LED Substrate

Application

The grinding wheels for LED substrate are mainly used for back thinning of 2”, 4” and 6”LED epitaxial wafers. They can be used steadily on the Japanese, Korean and Taiwanese grinders with high performance.

Workpiece: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer.

Material of workpiece: Synthetic sapphire, SiC ,single crystal silicon.

Grinders: WEC , GALAXY ,SPEEDFAM , NTS , SHUWA , OKAMOTO.

Main Features

Good surface quality with high efficiency

No deep scratch and crash

Long life and low cost


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